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| AMIS-30660 High Speed CAN Transceiver 1.0 Key Features * Fully compatible with the "ISO 11898-2" standard * Certified "Authentication on CAN Transceiver Conformance (d1.1)" * High speed (up to 1 Mbaud) * Ideally suited for 12V and 24V industrial and automotive applications * Low Electromagnetic Emission (EME) common-modechoke is no longer required * Differential receiver with wide common-mode range for high Electro Magnetic Susceptibility (EMS) (+/- 35V) Data Sheet * No disturbance of the bus lines with an unpowered node * Transmit data (TXD) dominant time-out function * Thermal protection * Bus pins protected against transients in an automotive environment * Power down mode in which the transmitter is disabled * Input levels compatible with 3.3V devices * Short-circuit proof to supply voltage & ground 2.0 General Description The AMIS-30660 CAN transceiver is the interface between a Controller Area Network (CAN) protocol controller and the physical bus and may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common mode voltage range of the receiver inputs, the AMIS-30660 is able to reach outstanding levels of electromagnetic susceptibility. Similarly, extremely low electromagnetic emission is achieved by the excellent matching of the output signals. 3.0 Important Characteristics Symbol VCANH VCANL Vi(dif)(bus_dom) Tpd(rec-dom) & Tpd(dom-rec) CM-range VCM-peak VCM-step Parameter DC voltage at pin CANH DC voltage at pin CANL Differential bus output voltage Propagation delay TxD to RxD Input common-mode range for comparator Common-mode peak Common-mode step Conditions 0 +35 500 150 V mV mV Note : The parameters VCM-peak and VCM-step guarantee low electromagnetic emission. * -85V min & +60V max also possible, please contact your local sales representative for details. 4.0 Ordering Information Part N AMIS-30660 Package SO-8 Temp. Range -40C...125C AMI Semiconductor www.amis.com 1 AMIS-30660 High Speed CAN Transceiver 5.0 Block Diagram Data Sheet Figure 1 - Block Diagram AMI Semiconductor www.amis.com 2 AMIS-30660 High Speed CAN Transceiver 6.0 Typical Application Schematic 6.1 Application schematic Data Sheet AMIS-30660 CLT (4.7 nF) CLT (4.7 nF) Figure 2 - Application Diagram 6.2 Typical external components Comp. RLT CLT CD Function Line termination resistor Line termination capacitor Decoupling capacitor Value 60 47 100 Units nF nF AMI Semiconductor www.amis.com 3 AMIS-30660 High Speed CAN Transceiver 6.3 Pin Description 6.3.1 Pin out (top view) Data Sheet AMIS30660 Figure 3 - Pin configuration 6.3.2 Pin Description Nr 1 2 3 4 5 6 7 8 Name TXD GND VCC RXD Vref CANL CANH S Type Description Transmit data input; low input => dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter => low output Reference voltage output LOW-level CAN bus line (low in dom. mode) HIGH-level CAN bus line (high in dom. mode) Select input for high-speed mode or silent mode (high in silent mode); internal pull-down current AMI Semiconductor www.amis.com 4 AMIS-30660 High Speed CAN Transceiver 7.0 Functional Description The AMIS-30660 is the interface between the CAN protocol controller and the physical bus. It is intended for use in automotive and industrial applications requiring baud rates up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 118982" standard. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Fig.4). Control pin S allows two operating modes to be selected: high-speed mode or silent mode. Data Sheet The high-speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is not connected. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control. A `TXD dominant time-out' timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TXD. Table 1: Function table of the CAN transceiver; X = don't care VCC 4.75 to 5.25V 4.75 to 5.25V 4.75 to 5.25V VCC 0 X 1 (or floating) S 0 (or floating) 1 X CANH HIGH 0.5VCC 0.5VCC CANL LOW 0.5VCC 0.5VCC BUS State Dominant Recessive Recessive RXD 0 1 1 X >2V X X 0V < VCANH 1 1 AMI Semiconductor www.amis.com 5 AMIS-30660 High Speed CAN Transceiver 8.0 Electrical Characteristics 8.1 Definitions Data Sheet All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. 8.2 Absolute maximum ratings Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability. Table 2 : Absolute maximum ratings Symbol VCC VCANH VCANL VTXD VRXD Vref VS Vtran(CANH) Vtran(CANL) Vesd Latch-up Tstg Tamb Tjunc Parameter Supply voltage DC voltage at pin CANH DC voltage at pin CANL DC voltage at pin TXD DC voltage at pin RXD DC voltage at pin Vref DC voltage at pin S Transient voltage at pin CANH Transient voltage at pin CANL Electrostatic discharge voltage at all pins Static latch-up at all pins Storage temperature Ambient temperature Maximum junction temperature Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit Min -0.3 -45* -45* -0.3 -0.3 -0.3 -0.3 -150 -150 -4000 -500 -55 -40 +150 Max +7 +45* +45* VCC+ 0.3 VCC + 0.3 VCC + 0.3 VCC + 0.3 +150 +150 +4000 +500 100 +150 +125 C Unit V V V V V V V V V V V mA C C Note 1 Note 1 Note 2 Note 4 Note 3 -40 * -85V min & +60V max also possible, please contact your local sales representative for details. Notes Note 1) Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a and 3b (see Fig.4). Note 2) Standardized Human Body Model ESD pulses in accordance to MIL883 method 3015. Note 3) Static latch-up immunity: Static latch-up protection level when tested according to EIA/JESD78. Note 4) Standardized Charged Device Model ESD pulses when tested according to EOS/ESD DS5.3-1993. Thermal Characteristcs Symbol Rth(vj-a) Rth(vj-s) Parameter Thermal resistance from junction to ambient in SO8 package (2 layer PCB) Thermal resistance from junction to substrate of bare die Conditions In free air In free air Value 150 45 Unit K/W K/W AMI Semiconductor www.amis.com 6 AMIS-30660 High Speed CAN Transceiver Characteristics Data Sheet VCC = 4.75 to 5.25 V; Tjunc = -40 to +150 C; RLT =60 unless specified otherwise. Symbol Supply (pin VCC) ICC Parameter Supply current Conditions Dominant; VTXD =0V Recessive; VTXD =VCC Output recessive Output dominant VTXD =VCC VTXD =0V Not tested Silent mode High-speed mode VS = 2V VS =0.8V IRXD = - 10mA IRXD = 6mA -50A 0.45 0.55 0.6 0.45 0.4 2.0 2.0 -2.5 -2.5 3.0 0. 5 1.5 -120 -45 45 0.5 2.5 2.5 3.6 1.4 2.25 0 -70 70 0.7 3.0 3.0 +2.5 +2.5 4.25 1.75 3.0 +50 -95 120 0.9 V V mA mA V V V mV mA mA V Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Short-circuit output current at pin CANH Short-circuit output current at pin CANL Differential receiver threshold voltage Differential receiver threshold voltage for high common-mode Differential receiver input voltage hysteresis Common mode input resistance at pin CANH Common mode input resistance at pin CANL Vihcm(dif)(th) 0.30 0.7 1.05 V Vi(dif) (hys) Ri(cm) (CANH) Ri(cm) (CANL) 50 70 100 mV 15 15 25 25 37 37 K K AMI Semiconductor www.amis.com 7 AMIS-30660 High Speed CAN Transceiver Symbol Ri(cm)(m) Parameter Matching between pin CANH and pin CANL common mode input resistance Differential input resistance Input capacitance at pin CANH Input capacitance at pin CANL Differential input capacitance Input leakage current at pin CANH Input leakage current at pin CANL Common-mode peak during transition from dom rec or rec dom Difference in common-mode between dom and recessive state POR level Conditions VCANH =VCANL Min -3 Type 0 Max +3 Data Sheet Unit % Ri(dif) Ci(CANH) Ci(CANL) Ci(dif) ILI(CANH) ILI(CANL) VCM-peak 25 VTXD =VCC; not tested VTXD =VCC; not tested VTXD =VCC; not tested VCC =0V; VCANH = 5V VCC =0V; VCANL = 5V See Fig. 8 & Fig. 9 50 7.5 7.5 3.75 170 170 75 20 20 10 250 250 500 K pF pF pF A A mV 10 10 -500 VCM-step See Fig. 8 & Fig. 9 -150 150 mV Power On Reset PORL CANH, CANL, Vref in tri-state below POR level 2.2 3.5 4.7 V Thermal shutdown Tj(sd) Shutdown junction temperature Timing characteristics (see Figs.6 and 7) td(TXD-BUSon) Delay TXD to bus active td(TXD-BUSoff) Delay TXD to bus inactive td(BUSon-RXD) Delay bus active to RXD td(BUSoff-RXD) Delay bus inactive to RXD tpd(rec-dom) Propagation delay TXD to RXD from recessive to dominant td(dom-rec) Propagation delay TXD to RXD from dominant to recessive 150 160 180 C VS = 0V VS = 0V VS = 0V VS = 0V VS = 0V VS = 0V 40 30 25 65 100 100 85 60 55 110 110 110 110 135 230 245 ns ns ns ns ns ns AMIS30660 Hysteresis Figure 4 - Test circuit for automotive transients Figure 5 - Hysteresis of the receiver AMI Semiconductor www.amis.com 8 AMIS-30660 High Speed CAN Transceiver Data Sheet AMIS30660 Figure 6 - Test circuit for timing characteristics Figure 7 - Timing diagram for AC characteristics AMIS30660 Figure 8 - Basic test set-up for electromagnetic measurement AMI Semiconductor www.amis.com 9 AMIS-30660 High Speed CAN Transceiver Data Sheet Figure 9 - Common-mode voltage peaks (see measurement setup Fig. 8.) Soldering Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250C. The top-surface temperature of the packages should preferably be kept below 230 C. Wave soldering If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board.The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and nonwetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Fix the component by first soldering two diagonallyopposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320C. AMI Semiconductor www.amis.com 10 AMIS-30660 High Speed CAN Transceiver Suitability of surface mount IC packages for wave and reflow soldering methods Package BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC (3) , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Soldering Method Wave Not suitable Not suitable (2) Suitable Not recommended (3)(4) Not recommended (5) Data Sheet Reflow (1) Suitable Suitable Suitable Suitable Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. Revision Number Version 1 Revision 1.1 Revision 1.2 Changes on page 1 and 6 8 AMI Semiconductor www.amis.com (c) Copyright 2003 AMI Semiconductor - All rights reserved. Information furnished is believed to be accurate and reliable. However, AMI Semiconductor assumes no responsibility for errors or omissions in the information and for the consequences of use of such information. AMI Semiconductor reserves the right to change the information contained herein at any time without notice. This information is provided "AS IS" without warranty of any kind, either expressed or implied, including, but not limited to, the implied warranties of merchantability, fitness for a particular purpose, or non-infringement of intellectual property. All title and intellectual property rights including, without limitation, copyrights, trademarks, in and to this information and products are owned by AMI Semiconductor, and are protected by applicable laws. No license under any patent or other intellectual property of AMI Semiconductor is granted, by implication, estoppel or otherwise. |
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